Supporting member for cooling means and electronic package using the same

ABSTRACT

An electronic package includes a supporting member, an electronic device, a carrier, a substrate a cooling means. The supporting member includes a plate and a bottom leg for supporting the plate. A first end of the bottom leg is joined to the lower surface of the plate. The carrier has a hole for receiving the bottom leg. The electronic device is connected to the carrier and is attached to the lower surface of the plate. A second end of the bottom leg is inserted into the hole of the carrier. The second end of the bottom leg is joined to the upper surface of the substrate. The electronic device is positioned between the plate of the supporting member and the substrate. The cooling is attached onto and supported by the upper surface of the plate.

BACKGROUND OF THE INVENTION

The present invention relates to a member for supporting cooling meansand an electronic package using the same, and more particularly to anelectronic package using the supporting member and a tape carrier.

A "tape carrier" refers to a flexible connecting structure comprising awiring to be connected to an electronic device and an insulating filmsupporting the wiring. The tape carrier includes tape automated bonding(TAB) films.

An "electronic package" refers to electrical components assembled as aunit. The electronic package may, but does not necessarily, comprise acell encapsulating the electrical components.

"Cooling means"refers to a device for absorbing and dissipating heatgenerated from an electric device. The cooling means may include heatsinks and/or liquid cooling modules. Examples of cooling means aredisclosed in Rao R. Tummala and Eugene J. Rymaszewski, "MicroElectronics Packaging Handbook", Van Nostrand Reinhold, New York, pp.209-219.

A conventional electronic package including cooling means and a tapecarrier is disclosed in FIG. 6-50 on p. 422 of the aforementionedreference.

This conventional electronic package has a heat sink as the coolingmeans. The heat sink is attached to the upper face of a large-scaleintegrated circuit (LSI). The lower face of the LSI is connected toinner leads of a tape carrier. Outer leads of the tape carrier areconnected to a substrate.

Nowadays, the conventional electronic package is widely used fordissipating heat the amount of which is increased by high-density andhigh-speed designs of LSIs.

A conventional connecting structure between a flexible circuitizedsubstrate and a printed substrate is disclosed in U.S. Pat. No.5,261,155.

In this conventional connecting structure, the flexible substrate andprinted substrate are connected by a solder ball provided therebetween,instead of outer leads of the flexible substrate.

However, the conventional package has the following problems.

First, the heat sink presses the LSI toward the substrate. Thus, the LSIis sandwiched between the heat sink and the substrate and may bedamaged.

Secondly, the weight of the heat sink produces a mechanical stress inthe tape carrier. Thus, connection between the tape carrier and thesubstrate may be damaged by the stress.

Thirdly, a process for assembling the conventional package must includea step of squeezing glue between the heat sink and the substrate so thatthe thickness of the glue becomes thin. The squeezing step isindispensable because thermal resistance between the heat sink and theLSI greatly depends on the thickness of the glue. In fact, theelectronic package is set aside at room temperature for several dayswith the glue squeezed between the heat sink and the substrate.

Fourthly, great care must be taken for precisely positioning theterminals of the tape carrier over the corresponding terminals of thesubstrate. This problem is serious when the conventional connectingstructure is applied in the conventional package because the terminalsare obscured under the tape carrier.

The conventional connecting structure also has a problem that a faultyor failed connection is not easily detected because the solder isobscured under the flexible substrate.

SUMMARY OF THE INVENTION

In view of the above problems of the conventional package and theconventional connecting structure, an object of the present invention isto provide a supporting member for cooling means and an electronicpackage using the supporting member. More specifically, the supportingmember frees an electronic device from being pressed by the coolingmeans and from being sandwiched between the cooling member and thesubstrate. The supporting member also frees the tape carrier from stresscaused by the weight of the cooling means.

Another object of the present invention is to provide a supportingmember which eliminates the step of squeezing glue between the coolingmeans and the supporting member.

Another object of the present invention is to provide a combination of asupporting member and a tape carrier which eliminates the need for thespecial attention for precise positioning of the tape carrier.

Another object of the present invention is to provide a connectingstructure in which a faulty or failed connection can easily be detected.

A supporting member according to the present invention comprises a plateand a bottom leg. The plate has first and second surfaces. The coolingmeans is placed on the first surface of the plate. An electronic deviceis attached to the second surface of the plate. The bottom leg is joinedto the second surface of the plate. The bottom leg may has a lengthgreater than a thickness of the electronic device.

The aforementioned supporting means may comprise first attaching meansfor attaching the cooling means onto the plate. The first attachingmeans may comprise a threaded upper leg joined to the first surface ofthe plate, the upper leg being inserted into a hole provided in thecooling means, and means threaded on the upper leg for securing thecooling means.

An electronic package according to the present invention comprises asupporting member, an electronic device, a carrier and a substrate. Thesupporting member includes a plate and a bottom leg. The plate has firstand second surfaces. The bottom leg has first and second ends. The firstend of the bottom leg is joined to the second surface of the plate. Theelectronic device is attached to the second surface of the plate of thesupporting member. The carrier has a first surface, a second surface anda hole. The second end of the bottom leg of the supporting member isinserted into the hole of the carrier. The substrate has first andsecond surfaces. The second end of the bottom leg is joined to the firstsurface of the substrate. The electronic device is positioned betweenthe plate of the supporting member and the substrate.

The aforementioned electronic package may be assembled in the followingsteps. In first and second steps, the supporting member and the carrierare prepared, respectively. In a third step, the electronic device isconnected to the carrier. In a fourth step, the electronic device isattached to the second surface of the plate. The second end of thebottom leg is inserted into a hole of the carrier. In a fifth step, thesecond end of the bottom leg is joined to the substrate. In a sixthstep, the cooling means is attached onto the first surface of the plate.

The aforementioned electronic package may comprise joining means forjoining the bottom leg of the supporting member to the first surface ofthe substrate.

The aforementioned electronic package also may comprise attaching meansfor attaching the cooling means to the supporting member. The attachingmeans may include a fastener and a threaded upper leg having first andsecond ends. The first end of the upper leg is inserted into the holeprovided in the cooling means. The second end of the upper leg is joinedto the first surface of the plate. The fastener is threaded on the upperleg to press the cooling means to the plate.

The attaching means, the upper leg, and the bottom leg are implementedby a pin inserted in the plate. In this structure, the plate of thesupporting member has a hole. The supporting member includes a pininserted into the hole of the plate. The pin has a threaded firstportion protruding from the first surface of the plate and a secondportion protruding from the second surface of the plate. The firstportion of the pin forms the upper leg of the supporting member. Thesecond portion of the pin forms the bottom leg of the supporting member.

When the upper leg and the bottom leg are implemented by the pin, theelectronic package may be assembled by the following steps. In firstthrough third steps, the carrier, the plate, and the pin are prepared,respectively. In a fourth step, the second end of the pin is joined to asubstrate. In a fifth step, the electronic device is attached to thesecond surface of the plate. In a sixth step, the pin is inserted intothe hole of the carrier and the hole of the plate. In a seventh step,the cooling means is attached onto the first surface of the plate.

The electronic package with a pin may comprise fixing means for fixingthe plate to the pin.

The aforementioned electronic package also may comprise connecting meansfor connecting the carrier to the substrate. The connecting means mayinclude a first pad provided on the carrier, a second pad provided onthe first surface of the substrate and solder for connecting the firstand second pads. The first pad may include a through-hole bored in thecarrier.

At least a portion of the solder is positioned in the through-hole ofthe first pad.

The aforementioned connecting means may be formed by the followingsteps. In a first step, solder is provided on the second pad of thesubstrate. In a second step, the first pad of the carrier is positionedon the solder. In a third step, the solder is heated to flow the solderinto the through-hole of the carrier.

In the aforementioned electronic package, the plate may include a firstportion covering the electronic device and a second portion covering thecarrier. The second portion of the plate may have a hole positionedabove the first pad of the carrier.

BRIEF DESCRIPTION OF THE DRAWINGS

Other objects, features and advantages of the present invention willbecome more apparent when the following description is read inconjunction with the accompanying drawings, wherein:

FIG. 1 is a perspective view of a supporting member 10 according to afirst embodiment of the present invention.

FIG. 2 shows the structure of a tape carrier 20 of the first embodimentthe present invention.

FIG. 3 shows the structure of an electronic package according to thefirst embodiment of the present invention.

FIGS. 4(a)-4(d) illustrate steps of the assembling process of theelectronic package shown in FIG. 3.

FIG. 5 shows the structure of an electronic package according to asecond embodiment of the present invention.

FIG. 6 shows the structure of a tape carrier 20' of the secondembodiment of the present invention.

FIGS. 7(a) and 7(b) show the detailed structure of a pad 31' shown inFIG. 6.

FIGS. 8(a)-8(c) illustrate steps of a process for connecting the pad 31'of the tape carrier 20 and a pad 33 of a substrate 42.

FIG. 9 shows the structure of an electronic package according to a thirdembodiment of the present invention.

FIGS. 10(a)-10(c) illustrate steps of the assembling process of theelectronic package shown in FIG. 9.

FIG. 11 illustrates a step of the assembling process of the electronicpackage shown in FIG. 9.

FIG. 12 shows the structure of an electronic package according to afourth embodiment of the present invention.

FIG. 13 shows the structure of an electronic package according to afifth embodiment of the present invention.

FIG. 14 shows the structure of an electronic package according to asixth embodiment of the present invention.

FIGS. 15(a)-15(c) show the detailed structure of a pin 18 shown in FIG.14.

FIG. 16 shows the structure of an electronic package according to aseventh embodiment of the present invention.

FIGS. 17(a)-17(e) show steps of the assembling process of the electronicpackage shown in FIG. 16.

FIG. 18 shows the structure of an electronic package according to theeighth embodiment of the present invention.

In these drawings, the same reference numerals depict the same parts,respectively.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Next is described the structure of a supporting member 10 according tothe first embodiment of the present invention.

Referring to FIG. 1, supporting member 10 comprises a square plate 12whose sides and thickness are about 22 mm and 1-2 mm, respectively. Theplate 12 serves as a heat sink or a heat radiating plate. The plate 12has four bottom legs 11 at each corner of its lower surface. The plate12 also has four upper legs 13 at each corner of its upper surface.

The plate 12 is made of a material with a relatively high thermalconductivity. Specifically, the plate 12 is preferably made of acopper-tungsten alloy, whose thermal conductivity and thermal expansioncoefficient are 180 W/mk and 6.5×10⁻⁶, respectively. Copper-Kovar alloy,Copper-Mo alloy and copper can also be used as the material of the plate12. Kovar is an alloy of iron, nickel and cobalt. The plate 12 can alsobe made of a ceramic with a relatively high thermal conductivity such asAlN.

Cooling means (e.g., a heat sink) and an electronic device (e.g., alarge-scale integrated circuit) are respectively attached to the upperand lower surface of the plate 12.

The bottom legs 11 are shaped as a cylindrical column whose diameter andheight are approximately 1.6-1.7 mm and 0.8 mm, respectively. The upperends of the bottom legs 11 are connected to the lower surface of theplate 12. The bottom legs 11 are preferably made of brass. The height ofthe bottom legs 11 is set so that the electronic device is not pressedagainst a substrate by the cooling means when the supporting member 10is placed on the substrate. Preferably, the height of the bottom legs 11is greater than the thickness of the electronic device.

The upper legs 13 are shaped as a cylindrical column whose diameter andheight are approximately 1.0 mm and 4.0 mm, respectively. The lower endsof the upper legs 13 are connected to the upper surface of the plate 12.The upper legs 13 are preferably made of brass. The upper portion of theupper leg 13 is threaded.

The supporting member 10 may be prepared by the following methods. Afirst method includes cutting a material body to form the bottom legs11, plate 12, and the upper legs 13. A second method includes solderingthe upper legs 13 and the bottom legs 11 to the plate 12. A third methodincludes boring through-holes in the plate 12 and inserting pins intothe thorough-holes. Then, the pins are soldered to the plate 12. Theportion of the pin protruding from the upper and lower faces of theplate 12 serves as the upper legs 13 and bottom legs 11, respectively.

Referring to FIG. 2, a tape carrier 20 which is used with the supportingmember 10 includes a film 26.

The thickness of the film 26 is about 50 μm. The film 26 is made of anorganic insulating resin with heat resistance and a low thermalexpansion coefficient. The film 26 is preferably made of a materialwhich is easily attachable to wirings 22 thereonto. Specifically, thefilm 26 is made of a polyimide. Fluororesins and epoxy resins can alsobe used as the material of the film 26.

The film 26 has circular holes 23 for receiving the bottom legs 11 ofthe supporting member 10. The holes 23 are shaped so as to fit to thebottom legs 11. In the first embodiment, the diameter of the holes 23 is1.8 mm.

The film 26 has a device hole 24 for receiving an electronic device(e.g., an LSI). In this exemplary embodiment, the device hole 24 isshaped as a square whose side is about 18.0 mm. However, the hole 24 canbe formed to have any shape so as to correspond to the shape of the LSI.

The tape carrier 20 has inner leads 21 protruding into the device hole24. In the exemplary embodiment, the number of the inner leads 21 isabout 800. The inner leads 21 are aligned with an 80 μm pitch. The innerleads 21 are connected to pads 31 via the wirings 21. The pads 31 aredisposed in a grid pattern. The inner leads 21, the wirings 22, and thepads 31 are formed on the lower surface of the tape carrier 20.

The tape carriers 20 of the first embodiment are formed in a tapeautomated bonding (TAB) tape which includes sequentially provided tapecarriers 20. Each tape carrier 20 occupies an area of 43 mm×43 mm. Holes25 are formed along both sides of the TAB tape. The tape carriers 20 aremoved by rotating a sprocket wheel by fitting the teeth of the sprocketwheel into the holes 25.

Referring to FIG. 3, an electronic package using the supporting member10 includes LSI chip 40 of 17.5 mm×17.5 mm. An integrated circuit isformed in the lower surface of the LSI 40. The LSI chip 40 has about 800input/output terminals (not shown) on the lower surface thereof. Theterminals are aligned with about an 80μm pitch. The terminals of the LSIchip 40 are connected to the inner leads 21 of the tape carrier 20. TheLSI chip 40 is received into the device hole 24 of the tape carrier 20.The lower surface of the LSI chip 40 and the inner leads 21 of the tapecarrier 20 are encapsulated in a resin 41.

The bottom legs 11 of the supporting member 10 are inserted into theholes 23 of the tape carrier 20. The upper surface of the LSI chip 40 isattached (e.g., glued) to the lower face of the plate 12 of thesupporting member 10 by an adhesive 44. The adhesive 44 is preferably anepoxy-type adhesive including silver powder as a filler. Au/Sn-typesolders can be used as the adhesive 44 instead of resins. When the LSIchip 40 is attached by a solder, a layer of Ti/Au or Ni is formed on theupper surface of the LSI chip 40 and the lower face of the plate 12.

The bottom legs 11 are connected (e.g., soldered by solder 111) to pads421 on a substrate 42. Any type of substrate can be used as thesubstrate 42. Among the substrates used as the substrate 42 are glassepoxy substrates, polyimide substrates, and ceramic substrates.

Pads 33 are formed on the upper face of the substrate 42. The pads 33are connected to the pads 31 of the tape carrier 20 via solder bumps 32.The pads 31, the solder bumps 32, and the pads 33 form a connectingstructure 30.

A heat sink 43 is attached to the upper face of the plate 12 of thesupporting member 10. The upper legs 13 of the supporting member 10 areinserted into holes 431 bored in the heat sink 43. The threaded upperportions of the upper legs 13 protrude through the upper face of theheat sink 43. Suitable fasteners (e.g., nuts) 47 are screwed onto theupper portion of the upper legs 13 to secure the heat sink 43 to thesupporting member 10. A silicone-type adhesive 45 is provided betweenthe lower face of the heat sink 43 and the upper face of the plate 12 ofthe supporting member 10.

The length between the upper surface of the LSI chip 40 and the lowersurface of the resin 41 is about 0.75 mm. Specifically, the thicknessesof the LSI chip 40 and the resin 41 are 0.45 mm and 0.3 mm,respectively. The resin 41 is kept from contacting the substrate 42.Thus, the LSI chip 40 is not pressed against the substrate 42 by theweight of the heat sink 43. The weight of the heat sink 43 does notproduce stress in the tape carrier 20. Further, the tape carrier 20 isnot loosened or pulled off from the substrate 42 by the heat sink 43when the substrate 42 is in an upright position.

Next is described the assembling process of the electronic package ofthe first embodiment.

Referring to FIG. 4(a), in step 1, the terminals of the LSI chip 40 areconnected to the inner leads 21 of the tape carrier 20. Thereafter, thelower surface of the LSI chip 40 and the inner leads 21 are encapsulatedin the resin 41.

Referring to FIG. 4(b), in step 2, the adhesive 44 is uniformlydistributed over the upper surface of the LSI chip 40 or the lower faceof the plate 12. Thereafter, the LSI chip 40 is attached to the lowerface of the plate 12 of the supporting member 10. The bottom legs 11 ofthe supporting member 10 are inserted into the holes 23 of the tapecarrier 20.

Referring to FIG. 4(c), in step 3, the supporting member is positionedsuch that the bottom legs 11 are positioned on the pads 421. Positioningof the supporting member 10 also positions each of the pads 31 above thecorresponding one of the pads 33.

The solder bumps 32 are preformed on the pads 33 of the substrate 42.The solder 111 is pre-applied on the pads 421 of the substrate 42. Afterthe positioning of the supporting member 10, the solder bumps 32 and thesolder 111 are heated to connect between the pads 31 and pads 33, andbetween the bottom legs 11 and the pads 421, respectively.

Referring to FIG. 4(d), in step 4, the adhesive 45 is uniformlydistributed over the upper face of the plate 12 or the lower face of theheat sink 43. Thereafter, the heat sink 43 is positioned on the plate12. The upper legs 13 of the supporting member 10 are inserted into theholes 431 (unreferenced in FIG. 4(d)) of the heat sink 43. The nuts 47press the heat sink 43 against the plate 12 to secure the heat sink 43on the plate 12. The heat sink 43 squeezes the adhesive 45 to uniformlydistribute and make the adhesive 45 thinner. The adhesion of theadhesive 45 takes about 24 hours and 15 minutes at room temperature andat a temperature of 150° C., respectively.

In the aforementioned assembling process, positioning of the tapecarrier 20 as in the conventional processes is unnecessary because thepositioning of the supporting member 10 simultaneously and preciselypositions the tape carrier 20 into a predetermined position.

Further, aforementioned assembling process does not include a step forsqueezing the adhesive 45 because the nuts 47 press the heat sink 43against the plate 12 to thereby squeeze the adhesive 45.

Next is described the second embodiment of the present invention. Thesecond embodiment has several features. A first feature is forming thebottom legs 11 and upper legs 13 of the supporting member 10 byinserting pins into the plate 12. Another feature is adopting a novelconnecting structure for the connection between the tape carrier 20 andthe substrate 42.

Referring to FIG. 5, a supporting member 10 of the second embodimentincludes four pins 14. The pins 14 are shaped as cylindrical columnswhose diameter is approximately 1.0 mm. The pins 14 are preferably madeof brass or Kovar. The pins 14 are preferably plated with nickel. Thelower ends of the pins 14 are connected (e.g., soldered by the solder143) to the pads 421 on substrate 42. The solder 143 is preferably Sn 63wt %--Pb 37 wt % eutectic solder. The pins 14 are threaded to receivenuts 142.

The LSI 40 is connected to the inner leads 21 of the tape carrier 20'.The pins 14 are inserted into the holes 23 of the tape carrier 20'. Thetape carrier 20' is connected to the substrate 42 via a connectingstructure 34. The detailed structures of the tape carrier 20' and theconnecting structure 34 are described below.

The size of the plate 12 is preset so that the plate 12 does not coverthe connecting structure 34. In the second embodiment, the plate 12 ispreferably a square whose sides and thickness are approximately 22 mmand 1-2 mm, respectively. The plate 12 has through-holes 124 at eachcorner. The pins 14 are inserted into the holes 124. The plate 12 issupported by the nuts 142. The LSI chip 40 is attached (e.g., glued) tothe lower face of the plate 12.

The heat sink 43 is attached (e.g., glued) to the upper face of theplate 12. The upper portions of the pins 14 are inserted into the holes431 of the heat sink 43. The heat sink 43 is secured by the nuts 141.The plate 12 and the heat sink 43 are securely held between the nuts 142and the nuts 141.

The material of the plate 12 is the same as that of the firstembodiment.

Next is described the structure of the tape carrier 20' and theconnecting structure 34.

Referring to FIG. 6, the inner leads 21 and the wirings 22 are formed onthe upper surface of the tape carrier 20'. One end of each of thewirings 22 is connected to one of the inner leads 21. The other end ofeach of the wirings 22 is connected to one of the pads 31'.

The wirings are preferably made of copper plated with gold. The widthand the thickness of the wirings are approximately 40 μm and 10-25 μm,respectively. The pads 31' are disposed in a grid pattern withapproximately a 1.27 mm pitch. The detailed structure of the pads 31' isdescribed below.

In the second embodiment, the diameter of the holes 23 of the tapecarrier 20' is set to approximately 1.1 mm to match the pins 14. Thematerial of the film 26 and the size of the device hole 24 are the sameas those of the first embodiment.

Next is described the structure of the pads 31'.

Referring to FIGS. 7(a) and 7(b), each of the pads 31' includes annularconductor patterns 36 and 39 on the upper and lower surface of the tapecarrier 20', respectively. The outer diameters of the conductor patterns36 and 39 are approximately 250 μm and 600 μm, respectively. The wirings22 are connected to the conductor pattern 36.

Referring to FIG. 8(b), each of the pads 31' further includes athrough-hole 38 which is formed in the film 26. The diameter of thethrough-hole 38 is set to approximately 150 μm and 300 μm at the upperand lower surfaces of the film 26, respectively, thereby tapering thethrough-hole 38. The advantages of such a tapered through-hole 38 aredescribed below. Another conductor pattern 37 is formed on the innersurface of the through-hole 38. The conductor pattern 37 connects theconductor patterns 36 and 39.

The conductor patterns 36, 37, and 39 are preferably made of copperplated with gold. The thickness of the conductor patterns isapproximately 20 μm.

Next is described the process for connecting the pads 31' of the tapecarrier 20' and the pads 33 of the substrate 42.

Referring to FIG. 8(a), in step 1, solder 35 is applied onto the pads 33of the substrate 42. The solder 35 is preferably Sn 63 wt %--Pb 37 wt %eutectic solder. The height and the volume of the solder 35 areapproximately 300 μm and 0.6×10⁻¹⁰ m³, respectively.

Referring to FIG. 8(b), in step 2, the pad 31' of the tape carrier 20'is positioned above the pad 33 of the substrate 42.

Referring to FIG. 8(c), in step 3, the solder 35 is heated toapproximately 200° C.-250 C. By heating, the solder 35 melts to travelor flow upwardly into the through-hole 38 by channeling. The solder 35that thus flows appears on the upper surface of the tape carrier 20' andis readily observable.

Next is described how a faulty or failed connection of the connectingstructure 34 is detected. If the solder 35 appears on the upper surfaceof the tape carrier 20', the connection is determined to be completed.However, if the solder 35 is absent, the connection may be faulty orcompletely failed. Thus, the connection failure in the connectingstructure 34 can be detected easily since the lack of solder 35 on thetape carrier 20' can be easily identified.

Thus, in addition to the features of the first embodiment, the secondembodiment allows a faulty or failed connection between the tape carrier20 and the substrate 42 to be easily detected.

Next is described a third embodiment of the present invention. Thefeature of the third embodiment is a modification of the means forsupporting the plate 12. Other structures and functions of the thirdembodiment are the same or similar to those of the first embodiment.

Referring to FIG. 9, in the third embodiment, each of pins 15 have firstand second portions. The diameters of the first portion 151 and thesecond portion 152 are approximately 1.0 mm and 1.6 mm, respectively.The length of the second portion 152 is approximately 1.8 mm. Thediameter of the holes 124 of the plate 12 and the holes 23 of the tapecarrier 20' are set to approximately 1.4 mm and 1.8 mm, respectively.The first portion 151 can be inserted into the holes 124 of the plate12, while the second portion 152 cannot be inserted thereinto. The plate12 is supported on the second portions 152 of the pins 15.

The lower ends of the second portions 152 are joined to the substrate 42by solder 153. In the third embodiment, the substrate 42 and solder 153are preferably a ceramic substrate and a Au--Sn type solder,respectively. The soldering of the solder 153 is performed at atemperature of approximately 350° C.

Thus, in addition to the features of the second embodiment, the thirdembodiment has several features. A first feature is that the nuts 142are eliminated. Another feature is that the length of the gap betweenthe substrate 42 and the plate 12 can be set precisely.

Next is described the assembling process of the third embodiment.

Referring to FIG. 10(a), in step 1, the LSI chip 40, which is connectedto the tape carrier 20', is attached to the lower surface of the plate12 by the adhesive 44.

Referring to FIG. 10(b), in step 2, the pins 15 are inserted into therespective holes 23 of the tape carrier 20' and into the respectiveholes 124 of the plate 12. The pins 15 are pre-joined to the substrate42. By inserting the pins 15 into the holes 23, each of the pads 31' ispositioned over the corresponding one of the pads 33.

Referring to FIG. 10(c), in step 3, the pads 31' and the pads 33 arejoined via solder 35 by the process shown in FIGS. 8(a)-8(c). A goodconnection is detected by the appearance of the solder 35 at the uppersurface of the tape carrier 20'.

Referring to FIG. 11, in step 4, the heat sink 43 is secured to theplate 12 by the nuts 141. The adhesive 45 is provided between the plate12 and the heat sink 43. By securing the nuts 141, the adhesive 45 issqueezed to become uniformly distributed and to have a smallerthickness.

Next is described the fourth embodiment of the present invention. Afeature of the fourth embodiment is a modification of the means forjoining the bottom legs 11 or pins to the substrate 42. Other structuresand functions of the fourth embodiment are the same or similar to thoseof the third embodiment.

Referring to FIG. 12, pins 16 have first, second, and third portions161-163, respectively. The structures of the first and second portionsare the same as those of the third embodiment. The diameter of the thirdportions of the pins 16 is approximately 0.8 mm. The third portion isplated with nickel.

In the fourth embodiment, the substrate 42 is preferably a glasspolyimide-type printed circuit board which is heat resistant and has alow permitivity. In the substrate 42, holes 48 are bored having a 0.8 mmdiameter. The third portions 163 of the pins 16 are inserted into theholes 48 and joined to the substrate 42 via solder 164. The solder 164flows into the gap between the holes 48 and the pins 16.

Thus, in addition to the features of the third embodiment, the fourthembodiment has the following features. A first feature is that the pins16 are positioned precisely. Another feature is that the strength of thejoint between the pins 16 and the substrate 42 is enhanced.

Next is described the fifth embodiment of the present invention. Afeature of the fifth embodiment is a modification of the means forjoining the lower legs 11 or pins to the substrate 42. The otherstructures and functions are the same or similar to those of the thirdembodiment.

Referring to FIG. 13, in the fifth embodiment, each of the pins 17 has afirst portion 171, a second portion 172, and a third portion 173 whosediameters are approximately 1.2 mm, 1.6 mm, and 0.7 mm, respectively.The length of the second portion 172 is approximately 0.8 mm. The pins17 are preferably made of stainless steel. The third portion 173 isthreaded.

In the substrate 42, holes 48 are bored having a 0.8 mm diameter. Thethird portions 173 of the pins 17 are inserted into the holes 48 of thesubstrate 42. The pins 17 are fixed to the substrate 42 by tighteningnuts 174 threaded on the pins 17.

Thus, in addition to the features of the third embodiment, the fifthembodiment has the following features. A first feature is that the pins16 can be positioned precisely. Another feature is that the strength ofthe joint between the pins 16 and the substrate 42 can be enhanced.

Next is described the sixth embodiment of the present invention. Afeature of the sixth embodiment is a modification of means for joiningthe lower legs 11 or pins to the substrate 42. The other structures andfunctions are the same or similar to those of the third embodiment.

Referring to FIG. 14, in the sixth embodiment, pins 18 have a firstportion 181, a second portion 182, and a press-fitting spring 183. Theconfiguration of the first portion 181 is the same as that of the thirdembodiment.

Referring to FIG. 15(a), the second portion 182 is a plate whose lengthis approximately 0.8 mm. The width of the second portion 182 is greaterthan the diameter of the holes 48 of the substrate 42 and the diameterof the holes 124 of the plate 12.

Referring to FIG. 15(b), the spring 183 has a tapered end.

DO Referring to FIG. 15(c), the cross-section of the spring 183 isM-shaped. The spring 183 has resiliency in the direction indicated bythe arrows. When the spring 183 is inserted in the holes 48 of thesubstrate 42, the spring 183 tightly fits (press-fitted) in the holes 48to fix the pin 18 to the substrate 42.

Thus, in addition to the features of the third embodiment, the sixthembodiment has the feature that the pins 18 can easily be fixed to thesubstrate 42.

Next is described the seventh embodiment of the present invention. Afeature of the seventh embodiment is that the plate 12 is made wider tocover the tape carrier 20.

Referring to FIG. 16, in the seventh embodiment, the plate 12 has afirst portion 121 and a second portion 122 which cover the LSI chip 40and the tape carrier 20, respectively. The LSI chip 40 is attached tothe lower face of the first portion 121 by the adhesive 44. The tapecarrier 20 is attached to the lower face of the second portion 122 by anadhesive 49. The material of the adhesive 49 is the same as that of theadhesive 44.

The tape carrier 20 and the substrate 42 are connected via theconnecting structure 30 used in the first embodiment. The connectingstructure 34 used in the second embodiment cannot be used in the seventhembodiment because the upper surface of the tape carrier 20 is coveredwith the second portion 122 of the plate 12.

Next is described the assembling process of the seventh embodiment.

Referring to FIG. 17(a), in step 1, the LSI chip 40 is connected to theinner leads 21 of the tape carrier 20.

Referring to FIG. 17(b), in step 2, the lower surface of the LSI chip 40is encapsulated by the resin 41.

Referring to FIG. 17(c), in step 3, the adhesive 44 is distributed overthe lower face of the first portion 121 of the plate 12 or over theupper surface of the LSI chip 40. The adhesive 49 is distributed overthe lower face of the second portion 122 of the plate 12 or over theupper face of the tape carrier 20. Thereafter, the LSI chip 40 and tapecarrier 20 are attached to the first portion 121 and the second portion122 of plate 12, respectively. The adhesive is cured at a temperature ofapproximately 150° C. for about 10 minutes.

Referring to FIG. 17(d), in step 4, pins 15 are inserted into therespective holes 23 of the tape carrier 20 and into the respective holes124 of the plate 12. Thereafter, the pads 31 and the pads 33 are joinedby soldering.

Referring to FIG. 17(e), in step 5, the heat sink 43 is attached ontothe plate 12.

In the seventh embodiment, the heat sink 43 thermally contacts thesecond portion 122 of the plate 12 as well as the first portion 121.Therefore, the thermal resistance between the plate 12 and the heat sink43 is reduced. Furthermore, the second portion 122 of the plate 12prevents the tape carrier 20 from warping.

Next is described the eighth embodiment of the present invention. Afeature of the eighth embodiment is boring holes in the second portion122 of the plate 12 to adapt the connecting structure 34 thereto.

Referring to FIG. 18, tape carrier 20 and the substrate 42 are connectedby the connecting structure 34 used in the second embodiment. Holes 123are bored in the second portion 122 of the plate 12. Each of the holes123 is positioned over the corresponding one of the pads 31' of theconnecting structure 34. The holes 123 make visible the solder 35 whichappears at the upper surface of the tape carrier 20.

Thus, in addition to the features of the seventh embodiment, the eighthembodiment has the feature that a faulty or failed connection betweenthe tape carrier 20 and the substrate 42 can easily be detected.

Next is described modifications of the aforementioned embodiments of thepresent invention.

First, the application of the present invention is not limited to theLSI chip 40. The present invention can be applied to any type ofelectronic device.

Secondly, the cross-section of the bottom legs and the pins can beformed in a variety of shapes. For example, the cross-section may berectangularly-shaped. The holes 23 of the tape carrier 20 must be shapedto fit the bottom legs and the pins.

Thirdly, the number and configuration of the upper legs, bottom legs,and pins are not limited to those of the aforementioned embodiments.

Fourthly, the heat sink 43 may be coated with insulating material (e.g.,epoxy or silicone) to avoid short-circuiting among the inner leads 21.

Fifth, the present invention can be applied to any type of cooling meansother than the heat sink 43.

The present embodiments are therefore, to be considered in all respectsas illustrative and not restrictive, the scope of the invention beingindicated by the appended claims rather than by the foregoingdescription and all changes which come within the meanings and range ofequivalency of the claims are therefore intended to the embracedtherein.

What is claimed is:
 1. A supporting member for supporting cooling meansfor cooling an electronic device, comprising:a plate having first andsecond surfaces, said cooling means being placed on said first surfaceof said plate, said electronic device being attached to said secondsurface of said plate; and a bottom leg integrally joined to said secondsurface of said plate, wherein said plate comprises one of a heat sinkand a heat radiating plate for preventing deformation of the electronicpackage, said electronic device being mounted on a film carrier and saidfilm carrier being mounted on a substrate, and wherein said supportingmember fixedly separates said electronic device from said cooling meansand said substrate such that said electronic device is out of thermalcontact with said substrate and said supporting member prevents pressurebeing imposed on said electronic device by said cooling means.
 2. Asupporting member according to claim 1, wherein said bottom leg has alength greater than a thickness of said electronic device.
 3. Asupporting member according to claim 1, further comprising firstattaching means for attaching said cooling means onto said plate.
 4. Asupporting member according to claim 3, wherein said cooling means has ahole formed therein, and said first attaching means comprises:a threadedupper leg joined to said first surface of said plate, said upper legbeing inserted into said hole of said cooling means, and means threadedon said upper leg for securing said cooling means.
 5. An electronicpackage according to claim 1, wherein said electronic device is bondedto said second surface of said plate.
 6. A supporting member forsupporting cooling means for cooling an electronic package, comprising:asupporting member including a plate and a bottom leg, said plate havingfirst and second surfaces, said bottom leg having first and second ends,said first end of said bottom leg being joined to said second surface ofsaid plate; an electronic device attached to said second surface of saidplate of said supporting member; a carrier having a first surface, asecond surface and a hole, said second end of said bottom leg of saidsupporting member being inserted into said hole of said carrier; and asubstrate having first and second surfaces, said second end of saidbottom leg being integrally joined to said first surface of saidsubstrate, said electronic device being positioned between said plate ofsaid supporting member and said substrate, wherein said plate comprisesone of a heat sink and a heat radiating plate, said supporting memberfor preventing deformation of the electronic package, and wherein saidsupporting member fixedly separates said electronic device from saidcooling means and said substrate such that said electronic device is outof thermal contact with said substrate and said supporting memberprevents pressure being imposed on said electronic device by saidcooling means.
 7. An electronic package according to claim 6, furthercomprising joining means for joining said bottom leg of said supportingmember to said first surface of said substrate.
 8. An electronic packageaccording to claim 7, wherein said joining means comprises solder forjoining said bottom leg and said substrate.
 9. An electronic packageaccording to claim 7, wherein said substrate has a hole, said second endof said bottom leg is inserted into said hole of said substrate, andsaid joining means comprises solder for joining said bottom leg and saidsubstrate.
 10. An electronic package according to claim 7, wherein saidsubstrate has a hole, said bottom leg of said supporting member includesa first portion having a diameter greater than a diameter of said holeof said substrate and a threaded second portion inserted into said holeof said substrate, said joining means includes a fastener threaded onsaid second portion of said bottom leg, and said substrate is placedbetween said fastener and said first portion of said bottom leg.
 11. Anelectronic package according to claim 7, wherein said substrate has ahole, and said joining means includes a spring for fitting into saidhole of said substrate.
 12. An electronic package according to claim 6,further comprising attaching means for attaching said cooling means tosaid supporting member.
 13. An electronic package according to claim 12,wherein said cooling means has a hole, said attaching means includes athreaded upper leg having first and second ends and a fastener, saidfirst end of said upper leg is inserted into said hole of said coolingmeans, said second end of said upper leg is joined to said first surfaceof said plate, and said fastener is threaded on said upper leg to presssaid cooling means to said plate.
 14. An electronic package according toclaim 13, wherein said plate of said supporting member has a hole, saidsupporting member includes a pin inserted into said hole of said plate,said pin has a threaded first portion protruding from said first surfaceof said plate and a second portion protruding from said second surfaceof said plate, said first portion of said pin forms said upper leg ofsaid supporting member, and said second portion of said pin forms saidbottom leg of said supporting member.
 15. An electronic packageaccording to claim 14, further comprising fixing means for fixing saidplate to said pin.
 16. An electronic package according to claim 15,wherein said fixing means includes solder for joining said plate to saidpin.
 17. An electronic package according to claim 15, wherein saidfixing means includes a second fastener threaded on said pin, and saidsecond fastener supports said second surface of said plate.
 18. Anelectronic package according to claim 14, wherein a diameter of saidsecond portion of said pin is greater than a diameter of said hole ofsaid plate, and said second portion of said pin supports said secondsurface of said plate.
 19. An electronic package according to claim 6,further comprising connecting means for connecting said carrier to saidsubstrate.
 20. An electronic package according to claim 19, saidconnecting means comprising:a first pad provided on said carrier; asecond pad provided on said first surface of said substrate; and solderfor connecting said first and second pads.
 21. An electronic packageaccording to claim 20, said first pad further including a through-holebored in said carrier.
 22. An electronic package according to claim 21,wherein at least a portion of said solder is positioned in saidthrough-hole of said first pad.
 23. An electronic package according toclaim 21, wherein a surface of said through-hole of said carrier isplated.
 24. An electronic package according to claim 23, wherein saidfirst pad of said carrier includes first and second conductor patternsprovided on said first and second surfaces of said carrier,respectively, and said first and second conductor patterns areelectrically connected via said through-hole of said carrier.
 25. Anelectronic package according to claim 6, wherein said plate of saidsupporting member includes a first portion covering said electronicdevice and a second portion covering said carrier.
 26. An electronicpackage according to claim 21, wherein said plate of said supportingmember includes a first portion covering said electronic device and asecond portion covering said carrier, said second portion of said platehaving a hole positioned above said first pad of said carrier.
 27. Anelectronic package according to claim 6, wherein said substratecomprises a wiring substrate.
 28. An electronic package according toclaim 6, wherein said carrier comprises a film carrier, and wherein saidelectronic device is bonded to said second surface of said plate.
 29. Anelectronic package according to claim 6, wherein said substratecomprises a wiring substrate and wherein said carrier comprises a filmcarrier, and wherein said electronic device is bonded to said secondsurface of said plate.